Title:
CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Document Type and Number:
Japanese Patent JP2019212467
Kind Code:
A
Abstract:
To provide a conductive material which, when electrically connecting between electrodes, can effectively increase conduction reliability and, further, can effectively increase insulation reliability.SOLUTION: The conductive material comprises a thermosetting component, a plurality of conductive particles, and a surfactant which removes an oxide layer of the conductive particles, wherein the thermosetting component contains a thermosetting compound, and the thermosetting component does not contain or contains a thermosetting agent. When the thermosetting component does not contain the thermosetting agent, an absolute value of the difference between the SP value of the thermosetting compound and the SP value of the surfactant is 2 or less, and when the thermosetting component contains the thermosetting agent, an absolute value of the difference between an SP value of the thermosetting compound and an SP value of the surfactant is 2 or less.SELECTED DRAWING: Figure 1
Inventors:
MASUI RYOHEI
YASUI HIDEFUMI
SADANAGA SHUJIRO
YASUI HIDEFUMI
SADANAGA SHUJIRO
Application Number:
JP2018107076A
Publication Date:
December 12, 2019
Filing Date:
June 04, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B1/22; H01B5/16; H01R11/01
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office