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Title:
CONDUCTIVE POLYMER COMPOSITION
Document Type and Number:
Japanese Patent JPS63317541
Kind Code:
A
Abstract:

PURPOSE: To obtain an electrically conductive polymer composition suitable as a shield for electromagnetic radiation, antistatic material, resistance heater, connector, etc., by compounding glass beads having diameter falling within a specific range and coated with Ni, Cu and/or Ag.

CONSTITUTION: Glass beads surface-coated with 5W50wt.%, preferably 10W40wt.% of at least one kind of metal selected from Ni, Cu and Ag are produced e.g. by catalyzing the surface of glass beads having diameter of 10W100μm and sphericity (major diameter/minor diameter) of preferably 1W2 e.g. with Pd, dispersing the beads in an aqueous solution of at least one kind of salt of a metal selected from Ni, Cu and Ag and adding a reducing agent to the dispersion to effect electroless plating. The obtained metal-coated glass beads are compounded in a polymer (e.g. acrylic polymer or urethane polymer) in an amount of 25W95wt.% to obtain the objective conductive polymer composition.


Inventors:
YOSHIZUMI MOTOHIKO
NAKABAYASHI AKIRA
SHIBUTA DAISUKE
Application Number:
JP15144187A
Publication Date:
December 26, 1988
Filing Date:
June 19, 1987
Export Citation:
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Assignee:
MITSUBISHI METAL CORP
International Classes:
C08K9/02; H01B1/22; (IPC1-7): C08K9/02; H01B1/22
Domestic Patent References:
JPS6096548A1985-05-30
JPS61225270A1986-10-07
JPS48101455A1973-12-20
Attorney, Agent or Firm:
Shoichi Hirose (1 person outside)



 
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