PURPOSE: To prevent a lead from bending during conveying by providing a feeding mechanism for intermittently feeding electronic components on rails without contacting with lead protruding from a sealer with the side different from the two side faces of the sealer as a reference of positioning it with respect to a conveying direction.
CONSTITUTION: Two rails 21 are bent in L-shaped section to be available from a stripelike plate, and laid in parallel along a horizontal conveying route in such a manner that the upper face of the bent and erected part is as a supporting face 21a, and the outer face is as a guide face 21b, and the gap of the guide faces 21b is matched with a slight margin in the width of a package 2. The faces 21a supports a semiconductor device 1 by supporting the vicinity of the root of a lead 3 at both sides of the package 2, and the face 21b guides it so as not to remove from the conveying route with the side faces of the package 2 facing the face 21b as a reference. A feeding rod 22 is formed in a rod-state, disposed in parallel between the two rails 21, its supporting face 22a supports the device 1 by supporting the bottom of the package 2, and the face 22b positions the conveying direction of the device 1 with the side faces of the packages 2 facing the faces 22a as a reference.
JPS61230020A | 1986-10-14 |
Next Patent: COMPONENT DISTRIBUTING METHOD FOR EACH WORKING STEP