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Title:
COPPER ALLOY THIN SHEET FOR PRODUCING CONNECTOR AND CONNECTOR PRODUCED BY THE THIN SHEET
Document Type and Number:
Japanese Patent JP3796784
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a copper alloy thin sheet for producing a connector not only excellent in tensile strength, elongation, electric conductivity and spring critical value, but also excellent in spring critical value after forming and ther mal creep characteristics and furthermore small in die wear in blanking and to provide a connector produced by the above copper alloy thin sheet.
SOLUTION: This steel sheet is composed of a copper alloy having a compsn. contg., by weight, 0.3 to 2% Mg, 0.001 to 0-02% P, 0.0002 to 0.0013% C and 0.0002 to 0.001% oxygen, and the balance Cu with inevitable impurities and having a structure in which oxide grains contg. fine Mg with ≤3μm grain size are uniformly dispersed into the matrix.


Inventors:
Suzuki Takeshi
Futatsuka training
Kuwahara Manpei
Seiji Kumagai
Application Number:
JP31402995A
Publication Date:
July 12, 2006
Filing Date:
December 01, 1995
Export Citation:
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Assignee:
Mitsubishi Shindoh Co., Ltd.
Mitsubishi Materials Corporation
International Classes:
C22C9/00; H01B1/02; (IPC1-7): C22C9/00; H01B1/02
Domestic Patent References:
JP5082203A
JP62070542A
Attorney, Agent or Firm:
Kazuo Tomita
Kutaro Kamoi



 
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