Title:
COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT, AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003168862
Kind Code:
A
Abstract:
To enhance the environmental adaptability by inexpensively providing an electrical insulation performance, electrical interference preventive performance and mechanical strength, obtaining resources except a petroleum.
The copper-clad laminate 5 is constituted by adhering a metal foil 2 for a circuit pattern on one surface of an insulating base material 1, forming a metal layer 3 for electrically shielding on the other surface, and then laminating the base material 1 so that the metal layer 3 is opposed to at least one surface of a circuit base material 4 via an adhesive material or the like.
Inventors:
HAYASHI HIDEOMI
Application Number:
JP2001368610A
Publication Date:
June 13, 2003
Filing Date:
December 03, 2001
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
B32B15/08; H05K1/02; H05K1/03; H05K1/11; H05K1/18; H05K3/40; H05K3/46; (IPC1-7): H05K3/46; B32B15/08; H05K1/02; H05K1/03; H05K1/11; H05K1/18; H05K3/40
Attorney, Agent or Firm:
Itami Masaru
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