PURPOSE: To make possible the low-cost and reliable corrosion prevention treatment of a circuit board by a method wherein in the circuit board, in which a ceramic substrate is provided with a wiring pattern and electrodes by a metal plating, a tin plating treatment is performed on the electrodes plated with a metal.
CONSTITUTION: An electroless copper plating is applied to a ceramic white substrate and moreover, a metal layer, such as a copper layer or the like, of a prescribed thickness is formed by an electrolytic plating. Then, a prescribed wiring pattern is formed by a photolithography technique and a part to be mounted with components excluding electrodes is covered with a solder resist. Then, a tin plating solution of a prescribed temperature is flashed and a tin layer of a prescribed plating thickness is formed on the electrodes, which are exposed on the substrate and are plated with a metal. Thereby, a metal-plated part is covered with a tin plating and a corrosion prevention treatment to an oxidation and the like is performed. After this, a chip component is mounted on the electrode plated with tin and the component is fixed on the electrode by a solder reflow. Accordingly, the corrosion prevention treatment can be performed at low cost and reliably.
| JPH09186430 | PRINTED WIRING BOARD AND PRODUCTION THEREOF |
| WO/2019/077816 | BASE MATERIAL FOR PRINTED WIRING BOARD, AND PRINTED WIRING BOARD |
| JP6075606 | Wiring boards and electronics |
TAKAHASHI TETSUYA
SEKINE NORIAKI
