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Title:
CURABLE RESIN COMPOSITIONS
Document Type and Number:
Japanese Patent JP2015004010
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide curable resin compositions which impart flame retardance to cured products of the resin compositions, have low roughness and sufficient peel strength, and allow preparation of cured products that can achieve low linear thermal expansion coefficients and low dielectric loss tangents.SOLUTION: A curable resin composition contains (A) one or more compounds represented by the general formula (1) in the figure, (B) an epoxy resin, (C) a curative for the epoxy resin, and (D) an inorganic filler.

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Inventors:
NAKAMURA SHIGEO
TATSUMI SHIRO
MIYAMOTO AKIRA
Application Number:
JP2013130626A
Publication Date:
January 08, 2015
Filing Date:
June 21, 2013
Export Citation:
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Assignee:
AJINOMOTO KK
International Classes:
C08L63/00; C08K3/36; C08K5/5313; H01L23/12; H05K1/03
Domestic Patent References:
JP2012064952A2012-03-29
JP2007146131A2007-06-14
Other References:
片山化学工業株式会社, 環境対応難燃化処理剤　５種, JPN6017000841, 25 June 2010 (2010-06-25), JP
Attorney, Agent or Firm:
辻居 Koichi
Sadao Kumakura
Atsushi Hakoda
Kenji Asai
Yamasaki Kazuo
Ichikawa Azalea
Hironobu Hattori



 
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