To provide a device capable of executing sputtering at a low cost by adequately masking a substrate of a CD, etc.

This device has a sputtering cathode 2 and masks or covers the substrate 27. The device has a central mask guiding element 56 on which the central mask 26 covering the substrate 27 is arranged. The central mask 26 operates cooperatively with an outer mask 4 in such a manner that only the un-covered parts of the substrate 27 are coated during the time of the coating stage. The outer mask 4 and/or the central mask 26 are adjusted in the positions in the direction of a central shaft 58 extending in a longitudinal direction respectively independently.