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Title:
DIAMOND-COVERED SUBSTRATE, ELECTRODE AND METHOD FOR ELECTROCHEMICAL TREATMENT, AND MANUFACTURING METHOD OF DIAMOND-COVERED SUBSTRATE
Document Type and Number:
Japanese Patent JP2008063607
Kind Code:
A
Abstract:

To provide a substrate which can be used as a substrate and can solve problems that the substrate itself is corroded during an electrochemical oxidation treatment, or the electrolysis cannot be continued by separating a diamond layer from the substrate, or the electrolytic efficiency is considerably degraded, and an electrode.

A diamond-covered substrate comprises a substrate and a conductive diamond layer covering the substrate, and the maximum area of a continuous portion of the diamond film constituting the diamond layer is 1 m2 and 100 mm2. In particular, the thickness of the diamond layer is preferably 3-100 m, and roughness Ra of the surface of the substrate is 0.1 m. In particular, the material of the substrate covered by the conductive diamond layer is any one of Nb, Ta, Zr and W.


Inventors:
SEKI YUICHIRO
IZUMI KENJI
IMAI TAKAHIRO
Application Number:
JP2006241172A
Publication Date:
March 21, 2008
Filing Date:
September 06, 2006
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C23C16/27; C02F1/461; C23C8/12; C23C16/04; C25B11/10; C30B29/04
Domestic Patent References:
JP2006076851A2006-03-23
JPH0230697A1990-02-01
JP2006070287A2006-03-16
JPH11130978A1999-05-18
JP2001140030A2001-05-22
JPH06318588A1994-11-15
JPH09268395A1997-10-14
JPH06128086A1994-05-10
JP2006010357A2006-01-12
Foreign References:
WO2004104272A12004-12-02
Other References:
JPN7010000944; Kentaro Tsunozaki,Yasuaki Einaga,Tata N. Rao,Akira Fujishima: 'Fabrication and Electrochemical Characterization of Boron-Doped Diamond Microdisc Array Electrodes' Chemistry Letters No.5, 20020505, 502,503
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Jun Komatsu
Hidetake Komatsu