Title:
ELECTROMAGNETIC WAVE ABSORBING SHEET AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2020013847
Kind Code:
A
Abstract:
To provide an electromagnetic wave absorbing sheet having good adhesiveness and excellent electromagnetic wave absorbing property, and a semiconductor device provided with the electromagnetic wave absorbing sheet.SOLUTION: An electromagnetic wave absorbing sheet according to an embodiment of the present invention includes: a noise absorbing layer that absorbs electromagnetic waves emitted from a semiconductor chip, and has a first surface, and a second surface opposite to the first surface; and a protective film forming film provided on at least one of the first surface and the second surface to form a protective film that protects the semiconductor chip.SELECTED DRAWING: Figure 1
Inventors:
MATSUSHITA TAIGA
INAO YOICHI
INAO YOICHI
Application Number:
JP2018134036A
Publication Date:
January 23, 2020
Filing Date:
July 17, 2018
Export Citation:
Assignee:
LINTEC CORP
International Classes:
H01L23/00; H01L21/301; H05K9/00
Domestic Patent References:
| JP2016092275A | 2016-05-23 | |||
| JP2004127986A | 2004-04-22 | |||
| JP2003017888A | 2003-01-17 | |||
| JP2013538456A | 2013-10-10 | |||
| JP2008109075A | 2008-05-08 |
Foreign References:
| WO2015076387A1 | 2015-05-28 | |||
| US20160133579A1 | 2016-05-12 | |||
| CN105766075A | 2016-07-13 | |||
| US20170002488A1 | 2017-01-05 | |||
| CN101155505A | 2008-04-02 | |||
| US20080180308A1 | 2008-07-31 |
Attorney, Agent or Firm:
Junichi Omori
Mitsuru Takahashi
Yukinobu Hibino
Mitsuru Takahashi
Yukinobu Hibino