電子装置

Japanese Patent JP7084134

B2

To provide a substrate for mounting an electronic element and an electronic apparatus excellent in heat radiation effect.SOLUTION: A substrate 1 for mounting an electronic element comprises: a first substrate 11 that has a first principal surface 111 and a second principal surface 112 opposite to the first principal surface 111, and has a rectangular shape having a mounting part for an electronic element 2 provided on the first principal surface 111; and a second substrate 12 that has a third principal surface 121 facing the second principal surface 112 and a fourth principal surface 122 opposite to the third principal surface 121, which are located on the second principal surface 112, are formed of a carbon material, and have a rectangular shape, and includes a plurality of concave parts 12a arranged in parallel on the fourth principal surface 122, wherein in plan view perspective, on the third principal surface 121 or the fourth principal surface 122, heat conduction in the parallel direction of the plurality of concave parts 12a is larger than heat conduction in a direction perpendicularly intersecting the parallel direction of the plurality of concave parts 12a.SELECTED DRAWING: Figure 2

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Noboru Kitazumi
Yousuke Moriyama

JP2017249575A

June 14, 2022

December 26, 2017

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Kyocera Corporation

H01L33/64; H01L23/02; H01L23/12; H01L23/36

JP2014075429A
JP2007027752A
JP2014515876A
JP2011023670A
JP2012238733A
JP2011159662A
JP2008028283A
JP2006114606A

WO2008053586A1
WO2016080393A1
US20070062676
KR1020160102727A

Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK

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