Title:
ELECTRONIC MODULE, COMBINATIONAL BODY, AND MANUFACTURING METHOD FOR ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2023163499
Kind Code:
A
Abstract:
To provide an electronic module that can achieve heat dissipation from the back surface through a back surface exposed part and can more securely prevent burrs, etc., from being generated due to resin wrapping around the back surface, a combinational body using the electronic module, and a manufacturing method for the electronic module.SOLUTION: An electronic module has electronic elements 10, a sealing part 90 that seals the electronic elements 10, and a back surface exposed part in which the electronic elements 10 are arranged on the front surface and the back surface is exposed from the sealing part 90. A recess 80 extending from the side surface to the inside is provided on the front surface of the sealing part 90. The recess 80 is positioned on the front surface side of the back surface exposed part.SELECTED DRAWING: Figure 3
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Inventors:
KAMIYAMA NETSUHIRO
Application Number:
JP2022074449A
Publication Date:
November 10, 2023
Filing Date:
April 28, 2022
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG
International Classes:
H01L21/56; H01L23/28; H01L23/48; H01L25/07
Attorney, Agent or Firm:
Seiji Ohno
Hiroyuki Ohno
Hiroyuki Ohno