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Patent Searching and Data


Title:
ELECTRONIC PACKAGE MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JPH04150099
Kind Code:
A
Abstract:

PURPOSE: To enable component setting placement change to be optimized by giving order of priority to the components and then changing the order of production according to frequency of use of the components to be used.

CONSTITUTION: Types to be produced are listed up according to input of production schedule, the frequency for using components is obtained, and the components to be used frequently are registered as fixed supply components. Then, a control device groups products with a same width for transport direction, determines order of production in the order which is similar to the component group, and then performs setting placement of the components to be inserted. Then, supply of components for a component sequencer is determined and device operation of the components is performed by controlling an automatic component insertion machine for executing production for each grouping, thus enabling setting operation when changing the width of the automatic component insertion machine to be reduced, working efficiency to be improved, and quality of products to be improved.


Inventors:
SAKUMA TAKEO
HIRAKURI TAKAFUSA
Application Number:
JP27455190A
Publication Date:
May 22, 1992
Filing Date:
October 15, 1990
Export Citation:
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Assignee:
HITACHI TELECOMM TECH
International Classes:
B23Q41/08; B65G61/00; G05B19/418; G06Q50/00; G06Q50/04; H05K13/02; (IPC1-7): B23Q41/08; G06F15/21; H05K13/02