To provide a film laminating method by which a build-up multi-layered wiring board having superior wiring pattern burying property in laminating and superior flatness after laminating and curing can be obtained in a short time.

An adhesive film having a base and a resin composition layer laminated on its top surface is put over a circuit board so that the resin composition layer comes into contact with at least a pattern of the circuit board. A laminating device having at least one operable press plate which can be heated and pressed and is made of heat-resisting rubber is used to press the adhesive film and circuit board at 70 to 150°C and 0.05 to 0.9 Mpa. Then a laminating device having at least one operable press plate which can be heated and pressed and is made of metal is used to press the adhesive film and circuit board at 70 to 170°C and 0.1 to 5 Mpa. Thus, a multi-layered circuit board is obtained by this adhesive film laminating method.