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Patent Searching and Data


Title:
FIXING DEVICE FOR POWER SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2005109385
Kind Code:
A
Abstract:

To provide a fixing device for a power semiconductor device, with which necessary insulating durability is assured, without using insulating spacer or the like, and breakdown of the semiconductor device due to a surge will not occur.

The fixing device comprises a heat-dissipating fin block 2, an insulating sheet 4 placed between the power semiconductor device 1 and the heat-dissipating fin block 2, and a fixing tool 3, which is formed of an insulating material and is fixed to the heat-dissipating-fin block 2 with a screw 5, to fix the power semiconductor device 1 to the heat-dissipating-fin block 2, wherein a wall part 3b positioned between the screw 5 and the power semiconductor device 1 is formed integrally in the fixing tool 3. Thereby, there is no concern necessary about the insulating distance or the like between the fixing tool 3 and the power semiconductor device 1. Also, even if a thunder surge is accidentally applied to the screw 5, the surge will be cut off by the wall part 3b, and the power semiconductor device 1 will not suffer a breakdown.


Inventors:
YAMAGUCHI SHIGERU
FUKUNISHI TAKAHIRO
NISHINOMIYA MASAFUMI
OKUI HIROSHI
Application Number:
JP2003344137A
Publication Date:
April 21, 2005
Filing Date:
October 02, 2003
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K7/20; H01L23/40; (IPC1-7): H01L23/40; H05K7/20
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito