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Title:
FIXING SOLUTION FOR FORMATION OF TRANSLUCENT CONDUCTIVE FILM, TRANSLUCENT CONDUCTIVE FILM, TRANSLUCENT ELECTROMAGNETIC WAVE SHIELD FILM, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2006267627
Kind Code:
A
Abstract:

To provide a conductive film having high conductivity and high translucency, an electromagnetic wave shield film patterned into thin lines and having both of high EMI (electro-magnetic interference) shield property and high transparency, and to provide a method for manufacturing a translucent electromagnetic wave shield film and a conductive film for inexpensively mass-producing the films without deteriorating the electromagnetic wave shield ability.

A fixing solution is provided which is used for the method for manufacturing a conductive film including at least a process of subjecting a monochromatic silver halide photographic sensitive material to developing and fixing to form a metal silver portion, and further plating the metal silver portion to impart conductivity. The fixing solution contains one or more kinds of specified compound. The translucent conductive film and the electromagnetic shield film are produced by using the fixing solution.


Inventors:
NOMURA HIDEAKI
Application Number:
JP2005086398A
Publication Date:
October 05, 2006
Filing Date:
March 24, 2005
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G09F9/00; G03C5/38; G03F7/06; G03F7/40; H01J11/44; H05K9/00
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu