Title:
フラックス及びソルダペースト
Document Type and Number:
Japanese Patent JP7063630
Kind Code:
B2
Abstract:
To provide flux which can suppress generation of void or can suppress generation of void and improve solder wettability, and solder paste therewith.SOLUTION: Flux contains rosin, tris(2-carboxyethyl) isocyanurate and a solvent, and the content of tris(2-carboxyethyl) isocyanurate is 0.1-15 mass%. Solder paste contains the flux and metal powder, and the flux contains the rosin, tris(2-carboxyethyl) isocyanurate and the solvent, and the content of tris(2-carboxyethyl) isocyanurate is 0.1-15 mass%.SELECTED DRAWING: None
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Inventors:
Yu Hashimoto
▲高▼木 和順
Tomoko Nagai
Nanako Miyagi
Kazuya Kitazawa
▲高▼木 和順
Tomoko Nagai
Nanako Miyagi
Kazuya Kitazawa
Application Number:
JP2018005033A
Publication Date:
May 09, 2022
Filing Date:
January 16, 2018
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/363
Domestic Patent References:
| JP2019013926A | ||||
| JP5392A | ||||
| JP2005528224A | ||||
| JP6312291A | ||||
| JP2014144473A |
Foreign References:
| WO2012118074A1 |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yamaguchi International Patent Office
Yoshio Arafune
Yamaguchi International Patent Office
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