Title:
FLUX FOR SOLDERING
Document Type and Number:
Japanese Patent JP3334376
Kind Code:
B2
Abstract:
PURPOSE: To decrease residues after soldering and to eliminate washing by developing sufficient activity even if a strong activator of an org. amine, etc., is used in a lesser amt. or is no longer used.
CONSTITUTION: Such solvent which does not substantially evaporate prior to soldering, forms films in soldering parts, exhibits the activity to reduce and remove the oxidized films of the soldered surfaces by thermal decomposition at the time of soldering and gradually vaporizes after soldering is used as the solvent. High boiling primary alcohols are used as the solvent. Further, a benzyl alcohol or 2 methyl cyclohexanol is used as the high boiling primary alcohol.
Inventors:
Kiyotaka Maekawa
Shigeki Saito
Shigeki Saito
Application Number:
JP27613094A
Publication Date:
October 15, 2002
Filing Date:
October 13, 1994
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B23K35/363; C07C33/22; (IPC1-7): B23K35/363
Domestic Patent References:
| JP5185282A | ||||
| JP679491A | ||||
| JP641601A | ||||
| JP466291A | ||||
| JP2290693A |