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Title:
FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JPS6024990
Kind Code:
A
Abstract:

PURPOSE: To enable to economically mass-produce a high-resolution resist pattern, by adopting a planographic printing system in place of a silk screen printing system.

CONSTITUTION: A printed pattern is provided on an objective substrate by a planographic printing system using a resist ink capable of being hardened by heat or active energy rays. The same pattern is further printed on the printed pattern on the substrate, thereby removing holes such as pinholes and eye-holes present in the pattern. The printed pattern is hardened by heating or by exposing it to active energy rays, thereby producing a resist pattern on the substrate. A pattern forming method excellent in property for economical mass-production is the planographic printing system. Even in the case of using this system, the printed pattern produced by overlappingly printing the same pattern becomes a continuous film free of holes, so that the pattern can be used satisfactorily as a resist pattern.


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Inventors:
YASUI TOSHIHIKO
MATSUMOTO TETSUO
AKAIKE AKIHIKO
Application Number:
JP13188683A
Publication Date:
February 07, 1985
Filing Date:
July 21, 1983
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
H05K3/06; B41M1/06; B41M1/26; B41M3/00; B41M7/00; G03C5/00; H05K3/18; (IPC1-7): B41M1/26; B41M3/00; G03C5/00; H05K3/06; H05K3/18
Attorney, Agent or Firm:
Takahashi victory



 
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