To provide heat dissipation equipment which is simultaneously provided on a plurality of rows of electronic components and reduces an occupancy space.
The heat dissipation equipment is used for cooling a plurality of rows of the electronic components on a circuit board and includes: a plurality of radiators; and a plurality of fixtures, wherein each of the radiators includes: a base; a plurality of fins which are provided on a surface of the base; and a first fixed part and a second fixed part, which are separately positioned in both sides of the base, and each of the fixture includes a head. The second fixed part of the one radiator is stacked on the first fixed part of the other radiator which is adjacent to the one radiator. The one fixture penetrates the first fixed part and the second fixed part, which are stacked, of the two radiators which are adjacent to each other. The first spring covers the one fixture and is sandwiched between the head of the fixture and the first fixed part, and the second spring covers the first spring and is sandwiched between the head of the fixture and the second fixed part.
COPYRIGHT: (C)2011,JPO&INPIT
LI MIN
KOJUN SEIMITSU KOGYO KOFUN YUGENKOSHI
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
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