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Patent Searching and Data


Title:
HEAT-RESISTANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH01229029
Kind Code:
A
Abstract:

PURPOSE: To obtain the title composition which is thermosetting, solvent-free, thus having high storage stability and excellent operability, because it is liquid, by mixing a specific resin composition with a polyamine and thermosetting the mixture.

CONSTITUTION: The subject composition is obtained by mixing (A) a resin composition which is produced by mixing, under heat, (i) a polymaleimide resin of formula I (R1 is n-valent organic group; Xa, Xb are H, halogen, organic group; n is 1W4) such as hexamethylene bismaleimide, (ii) an epoxy resin bearing at least 2 epoxy groups in the molecule such as bisphenol-A type epoxy resin and (iii) a compound bearing 1 alcoholic or phenolic hydroxyl group and one or more epoxy groups such as a compound of formula II and (B) a polyamine such as m-phenylenediamine, preferably at a weight ratio of 100:(10W50) and thermosetting.


Inventors:
OKITSU TOSHINAO
SATO SHINICHI
Application Number:
JP5407388A
Publication Date:
September 12, 1989
Filing Date:
March 08, 1988
Export Citation:
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Assignee:
KONISHI KK
International Classes:
C08G59/20; C08G59/40; C08G59/42; (IPC1-7): C08G59/20; C08G59/40
Attorney, Agent or Firm:
Takehiko Suzue (2 outside)