To provide an LED lamp which is sufficiently cooled at a high temperature atmosphere and has long life, and to provide a heating cooker including the LED lamp.
An LED lamp 1 includes: a glass epoxy substrate 3; a light emitting diode element 4 mounted on a first surface 31 of the glass epoxy substrate 3; a cover glass 7 covering the light emitting diode element 4 and the first surface 31 side of the glass epoxy substrate 3; an aluminum heat sink 2; and a connection terminal 5 electrically connecting with the light emitting diode element 4. The aluminum heat sink 2 has a flat adhesion plane surface 11 closely contacting with a second surface 32 of the glass epoxy substrate 3 which is the opposite side of the first surface 31 and a flat heat radiation plane surface 22 provided at the opposite side of the adhesion plane surface 11. The connection terminal 5 extends in the extension direction of the heat radiation plane surface 22 of the aluminum heat sink 2.
| JP3128244Y | ||||
| JP2004253364A | 2004-09-09 | |||
| JP2006186197A | 2006-07-13 | |||
| JP2006242420A | 2006-09-14 | |||
| JPS58102107A | 1983-06-17 | |||
| JP2007194172A | 2007-08-02 | |||
| JP2003124528A | 2003-04-25 | |||
| JP2009289751A | 2009-12-10 | |||
| JP2000156112A | 2000-06-06 | |||
| JPH08327071A | 1996-12-10 | |||
| JPS49118845U | 1974-10-11 |
Mitsuo Tanaka
Yukinori Nakakura
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