To provide an optical modulating module which can maintain a transmission reliability on the frequency of 2.5GHz and can reduce a matching resistance.
This high sped optical modulating module is made by a ceramic packaging a of lead frame 10 including an outer lead 12 and an inner lead 14 to which a high frequency signal is supplied, of a substrate 100 on which a metal base 60 with an impedance matching element containing a matching resistor 42 and a compensating capacitor 44 connected in parallel and a submount with a laser diode 28 are formed, of a first multiple bonding wire 46 which electrically connects the inner lead 14 of the lead frame 10 with a terminal of the impedance matching element, of a second multiple bonding wire 48 which electrically connects another terminal of the impedance matching element with a terminal of the metal base 60 and of a duplicate bonding wire 50 which electrically connects another terminal of the metal base 60 and the laser diode 28.
KIN SOBAI
KIN SEIICHI
BOKU KISHU