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Patent Searching and Data


Title:
HIGH SPEED OPTICAL MODULATING MODULE
Document Type and Number:
Japanese Patent JPH10145007
Kind Code:
A
Abstract:

To provide an optical modulating module which can maintain a transmission reliability on the frequency of 2.5GHz and can reduce a matching resistance.

This high sped optical modulating module is made by a ceramic packaging a of lead frame 10 including an outer lead 12 and an inner lead 14 to which a high frequency signal is supplied, of a substrate 100 on which a metal base 60 with an impedance matching element containing a matching resistor 42 and a compensating capacitor 44 connected in parallel and a submount with a laser diode 28 are formed, of a first multiple bonding wire 46 which electrically connects the inner lead 14 of the lead frame 10 with a terminal of the impedance matching element, of a second multiple bonding wire 48 which electrically connects another terminal of the impedance matching element with a terminal of the metal base 60 and of a duplicate bonding wire 50 which electrically connects another terminal of the metal base 60 and the laser diode 28.


Inventors:
RI KAIEI
KIN SOBAI
KIN SEIICHI
BOKU KISHU
Application Number:
JP24730997A
Publication Date:
May 29, 1998
Filing Date:
September 11, 1997
Export Citation:
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Assignee:
SAMSUNG ELECTRONIC
International Classes:
H01L25/00; H01S5/00; H01S5/022; H01S5/06; H04B10/516; H04B10/61; H01S5/062; (IPC1-7): H01S3/18; H01L25/00; H01S3/103; H04B10/04; H04B10/06; H04B10/142; H04B10/152
Attorney, Agent or Firm:
Masatake Shiga (1 person outside)