Title:
脆性材料基板の加工方法
Document Type and Number:
Japanese Patent JP5314674
Kind Code:
B2
Abstract:
Provided is a method for processing a fragile material substrate that can carry out stable laser break processing. A method for processing a fragile material substrate comprises (a) an initial crack forming step of forming an initial crack on a scribe scheduled line adjacent to the edge of a first substrate, (b) a laser scribe step of relatively moving a beam spot of the first laser irradiation from the edge of the first substrate to the edge of a second substrate along the scribe scheduled line to heat the substrates, immediately cooling a portion where the beam spot has passed, and forming a scribe line with a limited depth along the scribe scheduled line by using a stress gradient in the depth direction caused in the scribe scheduled line, and (c) a laser break step of relatively moving a beam spot of the second laser irradiation from the edge of the second substrate to the edge of a first substrate along the scribe line in the reverse direction to make the scribe line penetrate further deeply or completely cuts off the scribe line.
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Inventors:
Atsushi Imura
Kenji Fukuhara
Koji Yamamoto
Kenji Fukuhara
Koji Yamamoto
Application Number:
JP2010508153A
Publication Date:
October 16, 2013
Filing Date:
March 16, 2009
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/09; B23K26/364; B23K26/38; B23K26/40; B28D1/24; B28D5/00
Domestic Patent References:
| JP2006263819A | 2006-10-05 | |||
| JP2007099587A | 2007-04-19 | |||
| JP2006159747A | 2006-06-22 | |||
| JP2009012038A | 2009-01-22 | |||
| JP2008168304A | 2008-07-24 | |||
| JP2001176820A | 2001-06-29 | |||
| JP2006263819A | 2006-10-05 | |||
| JP2007099587A | 2007-04-19 | |||
| JP2006159747A | 2006-06-22 |
Foreign References:
| WO2006082899A1 | 2006-08-10 |
Attorney, Agent or Firm:
Yoshio Kashima