METHOD OF TREATING SUBSTRATE - ASM IP HOLDING BV

Title:

METHOD OF TREATING SUBSTRATE

Document Type and Number:

Japanese Patent JP2022106674

Kind Code:

A

Abstract:

To provide methods and related systems for lithographically defining patterns on a substrate.SOLUTION: An exemplary method includes forming a structure. The method includes providing a substrate to a reaction chamber. The substrate comprises a semiconductor and a surface layer. The surface layer comprises amorphous carbon. The method further comprises forming a barrier layer on the surface layer, and depositing a metal-containing layer on the substrate. The metal- containing layer comprises oxygen and a metal.SELECTED DRAWING: Figure 1

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Inventors:

LIU ZECHENG
YOSHIDA TAKASHI
NAKANO TATSU
IVAN ZYULKOV
SUN YITING
YOANN TOMCZAK
DAVID DE ROEST

Application Number:

JP2022000174A

Publication Date:

July 20, 2022

Filing Date:

January 04, 2022

Export Citation:

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Assignee:

ASM IP HOLDING BV

International Classes:

H01L21/318; G03F7/20; G03F7/38; H01L21/3065; H01L21/316

Attorney, Agent or Firm:

Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe

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