Title:
IC MOUNTING DEVICE
Document Type and Number:
Japanese Patent JPH08111596
Kind Code:
A
Abstract:
PURPOSE: To provide an IC mounting device where a DIP-type IC socket is capable of being mounted in a detachable manner and reusable.
CONSTITUTION: The terminal of a DIP-type IC socket 12 is made to penetrate through a through-hole 11a provided to a printed board 11, and a conductive fixing means 13 is fitted in the terminal in a detachable manner, whereby the printed board 11 and the DIP-type IC socket 12 are fixed together.
Inventors:
SUMITANI TAKASHI
Application Number:
JP24415194A
Publication Date:
April 30, 1996
Filing Date:
October 07, 1994
Export Citation:
Assignee:
NIPPON PRECISION CIRCUITS
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JPS60154697A | 1985-08-14 | |||
| JPS59155194A | 1984-09-04 | |||
| JPH0476983A | 1992-03-11 | |||
| JPH0251879A | 1990-02-21 | |||
| JP57088939B | ||||
| JPH022860B2 | 1990-01-19 | |||
| JPS6374545A | 1988-04-05 | |||
| JP52081053B | ||||
| JP4008500B |
Attorney, Agent or Firm:
Kazuko Matsuda
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