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Patent Searching and Data


Title:
IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2009088650
Kind Code:
A
Abstract:

To mount image sensors and circuit wiring in high density while ensuring the focal length of a lens.

The image sensor module 100 includes a core substrate 1 having circuit wiring 3b on the lower surface 1b and provided with a through hole 2, and a module substrate 4 having circuit wiring 3c on the upper surface 4a facing the lower surface 1b and provided with a recess 5 at a position facing the through hole 2 on the side of the upper surface 4a. A sensor 60 is mounted in the recess 5 of the module substrate 4 while directing the light receiving surface upward, and conductive portions (bumps 7a, 7b) transmits an electric signal converted by the sensor 60 to the circuit wiring 3b through the circuit wiring 3c.


Inventors:
SUZUKI DAIGO
FUKAYA GEN
Application Number:
JP2007252027A
Publication Date:
April 23, 2009
Filing Date:
September 27, 2007
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L27/14; H04N5/225; H04N5/335; H04N5/372; H04N5/374
Attorney, Agent or Firm:
Hiroshi Horiguchi