To provide an insulating resin composition that is excellent in moisture-resistant insulation reliability and can cope with semi-additive, to provide an insulating adhesive sheet for printed wiring board using the resin composition, and to provide a method of manufacturing printed wiring board.
In the insulating resin composition, an ionic impurity is removed from a thermosetting resin composition used for forming an insulating layer at the time of manufacturing a build-up multilayered wiring board by passing a dispersed liquid prepared by dispersing a resin composition containing (a) an epoxy resin, (b) a thermosetting agent, and (c) a rubber component as main components in a solvent through the mixture of cation and anion exchanging resins. The insulating adhesive sheet for printed wiring board uses the insulating resin composition, which is also used for the method of manufacturing printed wiring board.
KUMAKURA YOSHITOSHI
FUKAI HIROYUKI
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