Title:
It is the hardening method a hardenability epoxy constituent and for a short time.
Document Type and Number:
Japanese Patent JP6147770
Kind Code:
B2
Abstract:
Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≰120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.
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Inventors:
Megan, Jyonathan Yee
Application Number:
JP2014558919A
Publication Date:
June 14, 2017
Filing Date:
February 25, 2013
Export Citation:
Assignee:
Psytech Technology Corporation
International Classes:
C08G59/20; B29C45/02; C08G59/50; C08J5/24
Domestic Patent References:
| JP4275383A | ||||
| JP2011046797A | ||||
| JP2004292539A | ||||
| JP6131911A |
Foreign References:
| WO2009119467A1 | ||||
| KR20070115236A | ||||
| CN101585957A | ||||
| EP2159218A1 |
Attorney, Agent or Firm:
Patent business corporation Odashima patent office