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Title:
接合材とそれにより得られる接合体と接合体の製造方法
Document Type and Number:
Japanese Patent JP6799790
Kind Code:
B2
Abstract:
A bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which may form a compound along with tin and carbon, and Sn as the main component of a remainder.

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Inventors:
Hidetoshi Kitaura
Shigeki Sakaguchi
Application Number:
JP2016237027A
Publication Date:
December 16, 2020
Filing Date:
December 06, 2016
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C04B37/00; B23K35/26; C22C13/00
Domestic Patent References:
JP2000117427A
JP1095893A
JP2001058287A
JP2000326088A
Foreign References:
WO2015004467A2
US6231693
US3484210
US3361561
Attorney, Agent or Firm:
Samejima Mutsumi
Yoshida Tamaki



 
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