To provide a laser machining device which has an excellent machining precision and gives an improved working rate of the device even when the environmental condition of the body of a scanner varies.
A reflection face 7b in parallel with the reflection face 7a of a mirror 7 is provided on the opposite side of the reflection face 7a, and a beam radiation device 21 which radiates a guide beam 24 different from a machining laser beam 12, and a light receiving device 23 are provided. The light receiving device 23 is arranged at a position which is opposite to the beam radiation device 21 with respect to an axis perpendicular to the reflection face 7a of the mirror 7 so that the guide beam 24 is received. A rotation angle of the reflection face 7a is detected from the position of the guide beam 24 received by the light receiving device 23. A beam splitter 22 is arranged in the optical path of the guide beam 24, the magnitude of the displacement of the incident angle of the guide beam 24 with respect to the reflection face 7b is decided by measuring the displacement of the beam radiation device 21 by means of a light receiving device 25, the rotation angle of the reflection face 7a is corrected, then the positioning precision of the reflection face 7a is further improved.
AOYAMA HIROSHI
ISHII KAZUHISA
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