Title:
LEAD BONDER
Document Type and Number:
Japanese Patent JP2949939
Kind Code:
B2
Abstract:
PURPOSE: To provide means capable of bonding a lead of a device by pressing uniformly the lead on a substrate even when a top face of the substrate is inclined for an outer lead bonding.
CONSTITUTION: A lead bonder comprises a leaf spring 1 flexible in all directions consisting of a plurality of slits 11, a holder 12 for holding the leaf spring 1 horizontally, a positioning part 2 of an electric component 20 provided on a center part of the leaf spring 1, and means 16 for supporting the positioning part 2 flexibly from the lower direction.
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Inventors:
ONIZUKA YASUTO
Application Number:
JP20286191A
Publication Date:
September 20, 1999
Filing Date:
August 13, 1991
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP4334036A | ||||
| JP4324950A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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