Title:
LEAD-FREE SOLDER ALLOY COMPOSITION
Document Type and Number:
Japanese Patent JP2021053704
Kind Code:
A
Abstract:
To provide a lead-free solder alloy composition having excellent wettability and joint strength, and a method of preparing a lead-free solder alloy.SOLUTION: The lead-free solder alloy composition includes a ceramic powder added to a solder alloy of Sn-(0.1 to 2) wt.% Cu, Sn-(0.5 to 5) wt.% Ag, or Sn-(0.1 to 2) wt.% Cu-(0.5 to 5) wt.% Ag.EFFECT: According to this invention, a novel lead-free solder alloy composition, which acts as a substitute for a conventional lead-free solder, is provided, thus having better effect in spreadability, wettability and mechanical properties than conventional lead-free solders.SELECTED DRAWING: Figure 2a
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Inventors:
ASHUTOSH SHARMA
JUNG JAE PIL
YUN JONG HYUN
BAEK BUM GYU
SOHN HEUNG RAK
YIM SONG HEE
YOON JONG HYUK
JUNG JAE PIL
YUN JONG HYUN
BAEK BUM GYU
SOHN HEUNG RAK
YIM SONG HEE
YOON JONG HYUK
Application Number:
JP2020209069A
Publication Date:
April 08, 2021
Filing Date:
December 17, 2020
Export Citation:
Assignee:
KYUNG DONG ONE CORP
International Classes:
B23K35/26; B23K35/14; B23K35/363; C22C13/00
Domestic Patent References:
| JPH10180483A | 1998-07-07 | |||
| JP2008036691A | 2008-02-21 |
Foreign References:
| US20100200271A1 | 2010-08-12 | |||
| WO2013017885A2 | 2013-02-07 |
Attorney, Agent or Firm:
Hiroaki Saegusa