Title:
LEAD-FREE SOLDER
Document Type and Number:
Japanese Patent JP2000326088
Kind Code:
A
Abstract:
To obtain the solder not containing a harmful substance Pb and having sufficient joining strength for an oxide material for ceramic, etc. by containing essentially Sn, and Zn, further Ti in a specified ratio by weight %.
This solder is lead-free solder containing 0.001-3.0% Ti by weight. Preferably, the solder contains 0.001-3.0% Al by weight, further 0.001-9.0% Cu by weight, further, containing Sn and Zn so that a ratio (Sn/Zn) of Sn, Zn by weight % is 4.0-19.0, and further containing Sn and Zn, so that a ratio (Sn/Zn) of Sn, Zn by weight % is 9.0-12.0, but not essentially containing Cu, and containing one kind or more of the elements selected from among Bi, Si, Sb of ≤10% by weight in total, further containing 0.001-1.0% Si by weight.
Inventors:
DOKEN SHINJIRO
SAKAGUCHI KOICHI
NAKAGAKI SHIGEKI
SUGANUMA KATSUAKI
SAKAGUCHI KOICHI
NAKAGAKI SHIGEKI
SUGANUMA KATSUAKI
Application Number:
JP2000047325A
Publication Date:
November 28, 2000
Filing Date:
February 24, 2000
Export Citation:
Assignee:
NIPPON SHEET GLASS CO LTD
International Classes:
B23K35/26; B23K35/28; C03C27/10; C04B37/00; C22C13/00; (IPC1-7): B23K35/26; C03C27/10; C04B37/00; C22C13/00
Attorney, Agent or Firm:
Ohno Seiichi
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