Title:
LIQUID PHOTOSENSITIVE RESIN COMPOSITION FOR MANUFACTURING PRINTING PLATE
Document Type and Number:
Japanese Patent JP3835867
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid photosensitive resin composition capable of maintaining solvent resistance and enhancing resilience and surface tackiness.
SOLUTION: This resin composition comprises a prepolymer having an average molecular weight of 1,000-30,000 obtained by introducing at least one polymerizable ethylenically polymerizable double bond to the terminal of a hydrogenated 1,4-polybutadiene compound having terminal hydroxyl group and 1,4-structure proportion of ≥55mol% and/or the terminal of the prepolymer precursor obtained by extending the chain of the above polybutadiene compound by a diisocyanate thought urethane bonds; and an ethylenic monomer, and a photopolymerization initiator.
Inventors:
Tomita Yoko
Application Number:
JP31364396A
Publication Date:
October 18, 2006
Filing Date:
November 25, 1996
Export Citation:
Assignee:
Asahi Kasei Chemicals Corporation
International Classes:
G03F7/027; G03F7/00; G03F7/031; (IPC1-7): G03F7/027; G03F7/027; G03F7/00; G03F7/031
Domestic Patent References:
| JP5216228A | ||||
| JP62165643A | ||||
| JP55034930B1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Shinji Oga
Toshifumi Onuki