Title:
MANUFACTURE OF MULTICHIP MODULE
Document Type and Number:
Japanese Patent JPH1050756
Kind Code:
A
Abstract:
To provide a multichip module manufacturing method capable of performing characteristics evaluation monitoring signals at the time of manufacture, without lowering the real operation characteristic of a multichip module obtained in addition.
Along with providing wire bonding pads 4 for signals in the vicinity of a bare chip 2 to connect the bare chip 2 electrically, signal monitoring pads 8 are provided in the vicinities of the wire bonding pads 4 for signals. Next, the wire bonding pads 4 for signals 4 and the signal monitoring pads 8 are connected with wires 12. Following this, the bare chip 2 evaluated utilizing the wires 12 and the signal monitoring pads 8. After that, the wires 12 are cut.
Inventors:
OTSUKI YASUO
Application Number:
JP19862296A
Publication Date:
February 20, 1998
Filing Date:
July 29, 1996
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/60; H01L25/04; H01L25/18; (IPC1-7): H01L21/60; H01L21/60; H01L25/04; H01L25/18
Attorney, Agent or Firm:
Kuninori Funabashi
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