PURPOSE: To provide a manufacturing method for a multilayer printed wiring board, on which the contraction of an insulating substrate can be suppressed at the time of performing thermocompression bonding and a high-density circuit can be formed through simple work.

CONSTITUTION: In this the method, a multilayer printed wiring board is manufactured in such a way that insulating substrates 91 and 99 respectively provided with inner-layer circuits 52 are stacked with a prepreg 7 in between and the substrates 91 and 99 are stuck to the prepreg 7 by performing thermocompression bonding. Before the thermocompression bonding, films 1 having high coefficients of thermal expansion are put on the upper and lower surfaces of the laminated body and outermost boards 2 are put on both surfaces of the laminated body including the films 1. It is preferable to use a film having a coefficient of thermal expansion of ≥1.1×10-4mm/mm/°C (at 20°C) as the films 1. Polyethylene, polyvinyl fluoride, methylpentene resin, ethylene tetrafluoride resin, etc., can be used for forming the films 1.