To prevent generation of resin burrs in the case of manufacturing a plastic molded type electronic component.

In this manufacturing method of a resin molded electronic component, a metal mold 22 wherein an upper die 22a and a lower die 22b have flat surfaces 26 and 30, respectively, are prepared. When a lead frame assembly 18 is arranged in the metal mold 22, an outer lead 12 and linkage strips 16, 17 of the lead frame assembly 18 are clamped by the flat surface 26 of the upper die 22a and the flat surface 30 of the lower die 22b. A part of a molding space 34 is formed by the edge part 16a on the retaining plate 11 side of the linkage strips 16, 17 of the lead frame assembly 18. When fluidic resin is injected in the molding space 34, infiltration of resin into the part between the flat surface 26 of the upper die 22a and one main surface 12c of the outer lead 12 and the part between the flat surface 30 of the lower die 22b and the other main surface 12d of the outer lead 12 is blocked by the effect of adhesion between the upper die 22a and the linkage strips 16, 17 and between the lower die 22b and the linkage strips 16, 17.