Title:
プリント配線板からのリサイクル用有価金属原料の製造方法
Document Type and Number:
Japanese Patent JP5816449
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a recycling raw material of valuable metals such as high quality aluminum, gold, silver, copper by separating aluminum base substrate parts from print wiring boards having aluminum base substrates.SOLUTION: In the method for recovering the aluminum base substrates, an impact force of 190 N or more is applied to the print wiring substrates 1 in which electronic circuit is formed on the aluminum base substrates via insulating layers with a hammer, a blade, a chain 8, a wire or others. Thus, the aluminum base substrates can be easily peeled from the insulating layer by applying the impact to the print wiring substrates 1, further the valuable metals such as gold, silver, copper used for the printing wire boards can be separated to be used as the valuable metal raw materials for recycling.
More Like This:
Inventors:
Ryoichi Shirai
Kuniyoshi Hori
Hosaka Hideto
Honor Kenji
Kuniyoshi Hori
Hosaka Hideto
Honor Kenji
Application Number:
JP2011078059A
Publication Date:
November 18, 2015
Filing Date:
March 31, 2011
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
B09B3/00; B02C13/16; B02C13/18; B02C13/28; B09B5/00
Domestic Patent References:
| JP7246382A | ||||
| JP2002355661A | ||||
| JP2000301012A | ||||
| JP2007029923A | ||||
| JP2009195901A | ||||
| JP2003010706A | ||||
| JP2005524532A | ||||
| JP2003112077A | ||||
| JP5237411A |
Attorney, Agent or Firm:
Takeuchi/Ichizawa International Patent Office