METHOD AND DEVICE OF CLASSIFYING SUBSTRATE, METHOD AND DEVICE OF ESTIMATING ABNORMAL FACILITY, PROGRAM FOR EXECUTING THE METHOD OF CLASSIFYING SUBSTRATE OR THE METHOD OF ESTIMATING ABNORMAL FACILITY BY COMPUTER, AND COMPUTER READABLE RECORDING MEDIUM STORING THE PROGRAM

Japanese Patent JP2009070834

A

To provide a method and a device of classifying substrates by which, according to knowledge information concerning a known defect distribution, a group of substrates having the corresponding defect distribution can be accurately classified, and even substrates wherein an unknown defect distribution occurs can be automatically classified.

One or more closed areas wherein any defect exists on each of substrates are extracted, and a group of defects occupying the closed areas is determined as a target defect cluster (S101). Knowledge information concerning the known defect cluster is prepared. The plurality of target defect clusters obtained in S101 are classified into a known group similar to the known defect cluster and an unknown group not similar to the known defect cluster (S102). The groups of substrates are classified into a known group and an unknown group (S103). The target defect clusters classified as the unknown group are classified into a plurality of sub-groups, so that the groups of substrates classified as the unknown group are classified into a plurality of sub-groups (S105).

JPS6286836	PROBE CARD
JP6576342	Methods and wafer inspection tools for classifying defects
JPS61134049	SEMICONDUCTOR DEVICE

IMAI KATSUKI

JP2007234132A

April 02, 2009

September 10, 2007

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SHARP KK

H01L21/66; H01L21/02

JP2003515942A

2003-05-07

US20040156540A1	2004-08-12
US6148099A	2000-11-14

Hiroshi Yamazaki
Mitsuo Tanaka
Yukinori Nakakura

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