To make it possible to easily form, without severely lowering the productivity, a copper pattern 4' having a cross-sectional shape of a forward tapered shape when a copper film 4 deposited by electrolytic plating is etched to form the copper pattern 4'.

A method for forming a copper pattern includes a step for depositing a copper film 4 separately into a first copper film 4a and a second copper film 4b by using a first plating bath and a second bath, each containing a plating solution, and a step for making adjustments according to one or more of the following (A), (B), and (C): (A) making the concentration of a brightening agent of the plating solution used in the plating bath for depositing the first copper film 4a higher than that of the plating solution used in the plating bath for depositing the second copper film 4b; (B) making the concentration of a smoothing agent of the plating solution used in the plating bath for depositing the first copper film 4a lower than that of the plating solution used in the plating bath for depositing the second copper film 4b; and (C) making the temperature of the plating solution used in the plating bath for depositing the first copper film 4a higher than that of the plating solution used in the plating bath for depositing the second copper film 4b.