To provide a polishing method by granular media capable of selectively polishing only a given surface and as a result, also reducing polishing consumption energy.
A method is provided that a work (a substance to be polished) having at least one surface being a surface to be polished (a surface to be ground) and provide at the periphery of the central part of the surface to be polished with a through-gap is polished by using granular media. A liquid storage part 86 consisting of a sedimentation layer 83 formed of granular media (polishing media) 82 and a supernatant layer 84 is formed in a polishing tank 14. After a work 16 is immersed in the supernatant layer 84 with a surface 16a to be polished positioned opposite to the sedimentation layer 83, a work 16 is rotated and floating fluid toward the surface 16a to be polished is generated at the granular media 82 to effect polishing (grinding) of the surface 16a to be polished.
TANAHASHI SHIGERU
HIRANO MASAO
Next Patent: POLISHING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE