Title:
METHOD FOR RECOVERING CHIP
Document Type and Number:
Japanese Patent JP3825649
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve a problem that polishing chips and grinding chips, generated by dicing are all mixed together for disposal, and polishing chips and grinding chips generated by machining, such as CMP, are similarly disposed, and thus, since a material having a server environmental standard is also mixed for disposal, a waste a mount is extraordinarily increased, and even when it is recovered for recycling, it is substantially impossible.
SOLUTION: Drainage is divided classified by a material of a substance to be removed and impurity in a substance to be removed. The drainage is increased in density by a different filtering device 53 and a substance to be removed is recovered by different recovery devices 68.
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Inventors:
Motoyuki Contrast
Hirofumi Iinuma
Hirofumi Iinuma
Application Number:
JP2001105548A
Publication Date:
September 27, 2006
Filing Date:
January 17, 2000
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
B24B55/12; B24B57/02; B01D29/62; B01D29/66; B01D37/02; B01D65/02; B28D5/02; C02F1/44; H01L21/304; (IPC1-7): B24B55/12; B28D5/02; //H01L21/304
Domestic Patent References:
| JP31014685Y1 | ||||
| JP2086893A | ||||
| JP5185078A | ||||
| JP7108114A | ||||
| JP11019672A | ||||
| JP11048145A |
Attorney, Agent or Firm:
Takashi Okada
Katsuhiko Sudo
Katsuhiko Sudo
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