PURPOSE: To reduce the initial cost of a polishing device in a process of manufacturing super LSIs by applying pressure to a control ring for adjustment by means of pressure applying means for adjusting the force to press a polishing plate with the non-polishing face of a workpiece sucked or affixed to a base plate.

CONSTITUTION: A polishing plate 1 on which polishing cloth is stuck is journaled on a rotary shaft, and a base plate 2 is journaled on another rotary shaft, and a workpiece W is polished between these plates 1 and 2. The workpiece W, when being polished, is wrappedly supported by a control ring 3, and the non-polishing face Wb of the workpiece W is sucked to the top face of the base plate 2 by a vacuum pump or held by a sticking means with liquid such as pure water. When it is sucked or held, the control ring 3 is applied pressure for adjustment by a pressure applying means, and the pressing force of the polishing plate 1 by the ring 3, allowing a polishing device to cope with workpieces of a plurality of types.