Title:
モジュラープラットホームシステム及び装置
Document Type and Number:
Japanese Patent JP4184408
Kind Code:
B2
Abstract:
A modular platform is provided. The modular platform includes a modular platform shelf configured to receive modular platform boards, and a dual plenum coupled to the modular platform shelf, the modular platform configured to couple to a plenum portion of a dual plenum of another modular platform or a stand-alone plenum.
Inventors:
Way, wen
Application Number:
JP2006539646A
Publication Date:
November 19, 2008
Filing Date:
November 03, 2004
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H04Q1/02; H05K7/20
Domestic Patent References:
| JP6090089A | ||||
| JP2001326472A |
Foreign References:
| GB2387716A |
Attorney, Agent or Firm:
Akihiro Ryuka