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Title:
MOLDING APPARATUS AND MOLDING METHOD
Document Type and Number:
Japanese Patent JP2010013334
Kind Code:
A
Abstract:

To provide a molding method and a molding apparatus which can certainly suppress the generation of a damage on a surface of optical element.

In a molding method at the time of press molding a preform 60 using a metal mold 200, the pressing speed is reduced at a specified timing in order to suppress the generation of the damage on the surface of the optical element after being molded in a process of pressing the preform 60 using the metal mold 200. The pressing speed is reduced before the timing of an increase of the amount of movement in the preform 60 from a center part, such that the generation of the damage can be certainly suppressed caused by relatively moving a transfer surface 10c and the preform 60.


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Inventors:
UTSUKI MASANORI
Application Number:
JP2008177054A
Publication Date:
January 21, 2010
Filing Date:
July 07, 2008
Export Citation:
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Assignee:
FUJINON CORP
International Classes:
C03B11/16; B29C43/02; C03B11/00; G02B3/00; B29L11/00
Domestic Patent References:
JP2007031222A2007-02-08
JP2008150266A2008-07-03
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara



 
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