Title:
MOUNTING METHOD OF IC
Document Type and Number:
Japanese Patent JPH02181444
Kind Code:
A
Abstract:
PURPOSE: To ensure parallelism to a substrate of an IC chip by forming protrusions in equal height at three points or more on a pad for mounting the IC of the substrate.
CONSTITUTION: Protrusions 15 in equal height for keeping the parallelism of an IC chip 13 are shaped to the surface of the mounting pad 14 of the IC chip 13 formed onto a substrate 12. Adhesives 16 are applied in thickness thicker than the protrusions 15, and the IC 13 is held and fitted onto the adhesives 16 by a holding means 17. Accordingly, parallelism to the substrate of the IC chip is ensured, thus mounting the IC with high reliability.
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Inventors:
MURAOKA NOBUHIKO
KANAYAMA SHINJI
ENDO TAKAHIRO
NAKAMURA HITOSHI
MINAMITANI SHOZO
KANAYAMA SHINJI
ENDO TAKAHIRO
NAKAMURA HITOSHI
MINAMITANI SHOZO
Application Number:
JP170689A
Publication Date:
July 16, 1990
Filing Date:
January 06, 1989
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/32; H01L21/52; (IPC1-7): H01L21/52; H05K3/32
Attorney, Agent or Firm:
Shigetaka Awano (1 person outside)