Title:
MULTILAYER CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH06132620
Kind Code:
A
Abstract:
PURPOSE: To provide a multilayer ceramic circuit board for a high-speed LSI, which has an enhanced strength and toughness.
CONSTITUTION: Silicon nitride whiskers 1 are included in a ceramic structure of a circuit board. A bending strength, fracture toughness value of the structure are improved in proportion to an increased quantity of the whiskers 1.
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Inventors:
HO KEIICHIRO
INATA KAZUHIRO
INATA KAZUHIRO
Application Number:
JP27890692A
Publication Date:
May 13, 1994
Filing Date:
October 16, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K1/03; H05K3/46; (IPC1-7): H05K1/03; H05K3/46
Domestic Patent References:
| JPH0234599A | 1990-02-05 | |||
| JPH02192497A | 1990-07-30 | |||
| JPH02156593A | 1990-06-15 |
Attorney, Agent or Firm:
Sugano Naka