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Patent Searching and Data


Title:
MULTILAYER INTERCONNECTION BOARD
Document Type and Number:
Japanese Patent JPH01293697
Kind Code:
A
Abstract:

PURPOSE: To enhance the dimensional stability and to reduce the surface roughness by a method wherein an outer-layer material is arranged and united on the surface and/or the rear surface of the required number of inner-layer materials via a resin-coated laminated sheet.

CONSTITUTION: An outer-layer material is arranged and united on the surface and/or the rear surface of the required number of inner-layer materials via a resin-coated laminated sheet. The resincoated laminated sheet is obtained by piling up, laminating and shaping the required number of resin-impregnated boards which are obtained in such a way that a base material of a woven fabric or a nonwoven fabric composed of an inorganic fiber, an organic synthetic fiber or a natural fiber is impregnated with a resin. By this setup, the dimensional stability is enhanced remarkably and the surface roughness is reduced.


Inventors:
KOJIMA SHIGEAKI
Application Number:
JP12646288A
Publication Date:
November 27, 1989
Filing Date:
May 23, 1988
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)