Title:
PLATING METHOD AND PLATING APPARATUS
Document Type and Number:
Japanese Patent JP3286900
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plating method and plating apparatus capable of preventing the fixation of objects to be plated to a cathode and efficiently executing the plating of a prescribed film thickness.
SOLUTION: The plating is executed while mechanical vibration and ultrasonic vibration are applied continuously or intermittently at prescribed timing on the objects to be plated in the plating method by which the objects to be plated are electroplated by energizing between the cathode electrode and anode electrode while the objects to be plated are brought into contact with the cathode in the plating liquid. The energization between the cathode electrode and anode electrode is turned on and off to intermittently supply the current between the cathode electrode and the anode electrode and the ultrasonic vibration is applied on the objects to be plated at the timing at which the energization between the cathode electrode and the anode electrode is turned off. In addition, the vibration below 10Hz of the frequency is applied thereon as the mechanical vibration and the vibration of ≥1kHz in frequency is applied thereon as the ultrasonic vibration.
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Inventors:
Kazuma Tanaka
Shigehiro Nojiri
Kunihiko Hamada
Yoshinori Sakamoto
Yasunobu Yoneda
Shigehiro Nojiri
Kunihiko Hamada
Yoshinori Sakamoto
Yasunobu Yoneda
Application Number:
JP1740597A
Publication Date:
May 27, 2002
Filing Date:
January 14, 1997
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C25D5/20; C25D5/08; C25D5/18; H05K3/24; (IPC1-7): C25D5/20; C25D5/08; C25D5/18
Domestic Patent References:
| JP8296093A | ||||
| JP8277500A | ||||
| JP63312996A | ||||
| JP61103477U | ||||
| JP6128755B2 | ||||
| JP621291B2 | ||||
| JP6114237B2 |
Attorney, Agent or Firm:
Hitoshi Nishizawa